Košík
zboží
(prázdné)
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
číst celé
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
schovat popis
- Nakladatel: Springer-Verlag New York Inc.
- Kód:
- Rok vydání: 2009
- Jazyk: Angličtina
- Vazba: Gebunden
- Počet stran: 285
- Šířka balení: 16.5 cm
- Výška balení: 24.2 cm
- Hloubka balení: 2.3 cm
- Váha balení: 594 g
Recenze