Recenze A Method for the Assembly of Microelectronic Packages using Microwave Curing.

In this work a novel method for the assembly of microelectronic packages is described, which applies microwaves for the curing of adhesives. This comprises the conception and realization of a microwave curing system, based on an open-ended waveguide resonator and a prototype machine integrating the curing system. Extensive evaluation and testing reveal distinct benefits of the proposed method. schovat popis