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Develop and deploy powerful AI applications
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TECHNICAL SPECIFICATIONS
\nSoC | \nNXP i.MX 8M | \n
CPU | \nLPDDR4 1GB | \n
GPU | \nGC7000 Lite | \n
NN processor | \nGoogle Edge TPU ML accelerator coprocessor | \n
Display | \n 1 x HDMI with CEC hardware ready 1 x 22-pin MIPI DSI | \n
Memory Size | \nDual-CH LPDDR4 1GB | \n
Storage | \n 8GB eMMC Micro SD(TF) card slot (push/pull) | \n
Connectivity | \n 1 x RTL8211F-CG Gb LAN 1 x 802.11 a/b/g/n/ac wireless & Bluetooth 4.2 | \n
USB | \n 2 x USB 3.2 Gen1 Type-A 1 x USB 3.2 Gen1 Type-C OTG | \n
Camera Interface | \n2 x 24-pin MIPI CSI-2 | \n
Internal Headers | \n 1 x 40-pin headers includes: - up to 28 x GPIO pins - up to 1 x SPI bus - up to 2 x I2C bus - up to 2 x UART - up to 3 x PWM - up to 1 x PCM/I2S - 2 x 5V power pins - 2 x 3.3V power pins - 8 x ground pins 1 x Boot mode switch 1 x 2-pin Reset header 1 x 2-pin DC Fan header\n | \n
Power Connector (up to 45W) | \n12-19v DC Power Input Jack (5.5/2.5mm) | \n
OS Support | \nDebian 9 | \n
Dimensions | \n3.37 inch x 2.125 inch (8.55 cm x 5.4 cm) | \n
Environment | \n Operation temperature: 0? ~ 50? Non operation temperature: -40? ~ 80? Non operation humidity: 0% ~ 85% (Non condensing) | \n
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